Structures embedded within core material and methods of manufacturing thereof
US9087835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2013 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Dec 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.