Patent · US Active

Systems and methods for high-speed, low-profile memory packages and pinout designs

US9087846B2 · kind B2 · utility

4Cited by

2References

10Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Anthony Fai · Palo Alto, US
Evan R. Boyle · Cupertino, US
Zhiping Yang · Cupertino, US
Zhonghua Wu · Lo Wu, CN

Key dates

Filing date	Mar 13, 2013
Grant date	Jul 21, 2015
Priority date	—
Expiry date	Jun 16, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.