MEMS pressure transducer assembly
US9090455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2014 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Aug 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48137
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device. A trench (54) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform (48) at which the diaphragm resides. The MEMS die is suspended above a substrate (26) so that a clearance space (60) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment (68) via the aperture, the clearance space, and an external port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.