Protective film agent for laser dicing and wafer processing method using the protective film agent
US9090783B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 17, 2010 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Jul 30, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.