Patent · US Active

Method and apparatus for processing wafer-shaped articles

US9090854B2 · kind B2 · utility

1Cited by

6References

10Claims

0Family size

Assignee

Lam Research Corporation · US

Inventors

Stephan Hoffmann · Finkenstein, AT
Harald Kraus · Leverkusen, DE
Gunter METTIN · Villach, AT

Key dates

Filing date	Oct 25, 2011
Grant date	Jul 28, 2015
Priority date	—
Expiry date	Apr 5, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC11D2111/22
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.