Extended defect sizing range for wafer inspection
US9091666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Dec 8, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments for extended defect sizing range for wafer inspection are provided. One inspection system includes an illumination subsystem configured to direct light to the wafer. The system also includes an image sensor configured to detect light scattered from wafer defects and to generate output responsive to the scattered light. The image sensor is also configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. The system further includes a computer subsystem configured to detect the defects on the wafer using the output and to determine a size of the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge flows.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.