Detection of particle contamination on wafers
US9091667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2013 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of the detection of particle contamination on a semiconductor wafer is provides which includes examining an area of the semiconductor wafer by a metrology system comprising a scatterometry or ellipsometry/reflectometry tool to obtain measured metrology data, comparing the measured metrology data with reference metrology data and determining the presence of particle contamination in the examined area of the semiconductor wafer based on the comparison of the measured metrology data with the reference metrology data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.