Method and apparatus for warming up integrated circuits
US9093127B1 · kind B1 · utility
2Cited by
10References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2013 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 21, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/50
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Aspects of the disclosure provide an integrated circuit (IC) chip. The IC chip includes functional circuits configured to perform desired functions when a chip temperature is higher than a threshold, such as a room temperature. The IC chip includes a warm-up module configured to warm-up the IC chip in a warm-up mode to raise the chip temperature above the threshold. A method for warming up an IC chip prior to operation is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.