High voltage low current surface emitting light emitting diode
US9093293B2 · kind B2 · utility
4Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2011 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Jan 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode chip includes a submount, a reflective layer on the submount, an insulating layer on the reflective layer opposite the submount, and a plurality of sub-LEDs on the insulating layer. Each of the sub-LEDs includes a first face adjacent to the submount and a transparent contact on the first face between the sub-LED and the insulating layer and electrical interconnects between adjacent ones of the sub-LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.