Methods for controlling warpage in packaging
US9093337B2 · kind B2 · utility
17Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.