Tape package and flat panel display device including the same
US9093443B2 · kind B2 · utility
4Cited by
1References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2014 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Feb 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a tape package and a flat panel display device including the tape package. The tape package includes a base film, a semiconductor chip mounted on one surface of the base film, a wire pattern including an input wire pattern and an output wire pattern formed on one surface of the base film and electrically connected with the semiconductor chip, a solder resist covering the remaining portion, except for an end of the wire pattern, and a protection film provided on an edge at one side of the solder resist facing an end of the output wire pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.