Patent · US Active

Micromechanical component and method for manufacturing a micromechanical component

US9097736B2 · kind B2 · utility

1Cited by

10References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Johannes Classen · Reutlingen, DE
Arnd Kaelberer · Neckargemünd, DE
Lars Tebje · Reutlingen, DE

Key dates

Filing date	Oct 24, 2012
Grant date	Aug 4, 2015
Priority date	—
Expiry date	Jul 26, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.