Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology
US9098891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Mar 27, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.