Patent · US Active

Power management applications of interconnect substrates

US9099340B2 · kind B2 · utility

8Cited by
10References
37Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 4, 2012
Grant dateAug 4, 2015
Priority date
Expiry dateJan 31, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/381
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Various applications of interconnect substrates in power management systems are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.