Power module package and method of manufacturing the same
US9099451B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 12, 2014 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | May 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a power module package and a method of manufacturing the same. The power module package includes first and second semiconductor devices mounted on sides of first and second lead frames, ends of which are separated from each other, respectively, a support pin corresponding to a mounting position of the first semiconductor device and formed adjacent to a lower portion of the first lead frame, and a molding portion formed to cover portions of the first and second lead frames and the first and second semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.