Job Ha
10Patents
3h-index
31Co-inventors
56Inventor score
Filing activity: May 22, 2008 → Feb 10, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD717254S1 | Semiconductor device | General | 46 | Active |
| USD717253S1 | Semiconductor device | General | 41 | Active |
| USD717256S1 | Semiconductor device | General | 40 | Active |
| US9455207B2 | All-in-one power semiconductor module | Electricity | 2 | Active |
| US10559541B2 | Semiconductor package | Electricity | 1 | Active |
| US7911043B2 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Electricity | 1 | Active |
| US9099451B2 | Power module package and method of manufacturing the same | Electricity | 1 | Active |
| US10811358B2 | Hybrid interposer and semiconductor package including the same | Electricity | 1 | Active |
| US10854561B2 | Semiconductor package | Electricity | 0 | Active |
| US11227835B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.