Reconfigurable guide pin design for centering wafers having different sizes
US9099515B2 · kind B2 · utility
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41References
19Claims
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Key dates
| Filing date | Aug 22, 2013 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Aug 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20305
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a robot arm, and a plurality of guide pins mounted on the robot arm. Each of the plurality of guide pins includes a plurality of wafer supports at different levels, with each of the plurality of wafer supports configured to support and center a wafer having a size different from wafers configured to be supported and centered by remaining ones of the plurality of wafer supports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.