Patent · US Active

Support for use in microchannel processing

US9101890B2 · kind B2 · utility

19Cited by

85References

45Claims

0Family size

Assignee

Velocys, Inc. · US

Inventors

Anna Lee Tonkovich · Dublin, US
Kai Jarosch · Bexley, US
Jeffrey D. Marco · South Charleston, US
Bin Yang · San Diego, US
Sean P. Fitzgerald · Columbus, US
Steven T. Perry · Galloway, US
Thomas Yuschak · Lewis Center, US
Francis P. Daly · Delaware, US
Haibiao Chen · Dublin, US

Key dates

Filing date	May 25, 2006
Grant date	Aug 11, 2015
Priority date	—
Expiry date	Sep 6, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P20/582
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.