Integrated circuit package with multiple dies and a multiplexed communications interface
US9105316B2 · kind B2 · utility
3Cited by
22References
24Claims
0Family size
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Key dates
| Filing date | Dec 10, 2013 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Jan 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die. An interface connects the first die and the second die. At least one of the first and second dies includes a memory. The interface is configured to transport both control signals and memory transactions. A multiplexing circuit multiplexes the control signals and the memory transactions onto the interface such that connections of the interface are shared by the control signals and the memory transactions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.