Patent · US Active

Method for forming fin field effect transistor

US9105475B1 · kind B1 · utility

4Cited by
0References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 18, 2014
Grant dateAug 11, 2015
Priority date
Expiry dateMar 18, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/017
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for forming a fin field effect transistor is provided. The method includes: providing a substrate; forming a fin structure with a material Ge or GeSi on the substrate; implanting atoms, molecules, ions or plasmas containing an element Sn into the fin structure with the material Ge or GeSi to form a Ge-based GeSn layer or a Ge-based GeSnSi layer; and forming a gate stack on the Ge-based GeSn layer or the Ge-based GeSnSi layer, the gate stack being oriented transversely to the fin structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.