Method for forming fin field effect transistor
US9105475B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Mar 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a fin field effect transistor is provided. The method includes: providing a substrate; forming a fin structure with a material Ge or GeSi on the substrate; implanting atoms, molecules, ions or plasmas containing an element Sn into the fin structure with the material Ge or GeSi to form a Ge-based GeSn layer or a Ge-based GeSnSi layer; and forming a gate stack on the Ge-based GeSn layer or the Ge-based GeSnSi layer, the gate stack being oriented transversely to the fin structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.