Bump structure having a single side recess
US9105533B2 · kind B2 · utility
7Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2014 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Oct 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure includes a first end, and a second end opposite the first end. The bump structure further includes a first side connected between the first end and the second end. The bump structure further includes a second side opposite the first side. The second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.