Sparsely-bonded CMOS hybrid imager
US9105548B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2012 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Jan 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.