Patent · US Active

Sparsely-bonded CMOS hybrid imager

US9105548B2 · kind B2 · utility

2Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 22, 2012
Grant dateAug 11, 2015
Priority date
Expiry dateJan 19, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/014
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.