Method for producing at least one optoelectronic semiconductor component

US9105771B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Weidner · Birkenfeld, DE
• Hans Wulkesch · Birkenfeld, DE
• Axel Kaltenbacher · Ingolstadt, DE
• Walter Wegleiter · Nittendorf, DE
• Johann Ramchen · Altdorf, DE

Key dates

• Filing date: Aug 12, 2011
• Grant date: Aug 11, 2015
• Expiry date: Sep 12, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.