Multilayer chemical mechanical polishing pad
US9108290B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2013 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Jan 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B37/1284
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the broad spectrum, endpoint detection window block is disposed within the counterbore opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.