Methods for producing rectangular seeds for ingot growth
US9111745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Jun 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.