Polishing pad
US9114501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface, the angle α is larger than 90 degrees, the angle β is not smaller than 85 degrees, and the angle β is smaller than the angle α, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10−6 μm/Pa and not more than 4.4×10−4 μm/Pa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.