Method for manufacturing a component having an electrical through-connection

US9114978B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jochen Reinmuth · Reutlingen, DE
• Jens Frey · Echterdingen, DE
• Yvonne Bergmann · Reutlingen, DE

Key dates

• Filing date: Jun 19, 2013
• Grant date: Aug 25, 2015
• Expiry date: Jun 19, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2207/095
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.