Patent · US Active

Microelectromechanical system package and method of testing

US9116165B2 · kind B2 · utility

0Cited by

3References

15Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Mark E. Schlarmann · Chandler, US
Yau Kin Hon · Gilbert, US
Eric W. Tisinger · Chandler, US

Key dates

Filing date	Mar 27, 2012
Grant date	Aug 25, 2015
Priority date	—
Expiry date	Oct 16, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG01P15/125
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.