Patent · US Active

Method for activating a porous layer surface

US9117666B2 · kind B2 · utility

4Cited by

4References

11Claims

0Family size

Assignees

IMEC VZW · BE
Katholieke Universiteit Leuven, KU LEUVEN R&D · BE

Inventors

Quoc Toan Le · Belgrade, BE
Mikhail Baklanov · Veltem-Beisem, BE
Yiting Sun · Leuven, BE
Silvia Armini · Leuven, BE

Key dates

Filing date	Nov 26, 2014
Grant date	Aug 25, 2015
Priority date	—
Expiry date	Nov 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76831
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method is provided for activating an exposed surface of a porous dielectric layer, the method comprising the steps of: filling with a first liquid at least the pores present in a part of the porous dielectric layer, the part comprising the exposed surface, removing the first liquid selectively from the surface, activating the exposed surface, and removing the first liquid from the bulk part of the porous dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.