Three-dimensional inter-chip contact through vertical displacement MEMS
US9123492B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.