Semiconductor module package
US9123688B2 · kind B2 · utility
0Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Oct 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a semiconductor module package, including: a first module including a first heat radiation substrate and one or more first semiconductor elements and having a first N terminal and a first P terminal formed at one end thereof; a second module including a second heat radiation substrate and one or more second semiconductor elements, having a second N terminal and a second P terminal formed at one end thereof, and disposed so as to face the first module; and a first output terminal formed by electrically connecting the first module to the second module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.