Si Joong Yang
8Patents
4h-index
25Co-inventors
53Inventor score
Filing activity: May 16, 2008 → Aug 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD719113S1 | Semiconductor device | General | 40 | Active |
| USD719926S1 | Semiconductor device | General | 30 | Active |
| USD703625S1 | Power semiconductor module | General | 29 | Active |
| US7696004B2 | Wafer level package fabrication method | Electricity | 14 | Active |
| US9455207B2 | All-in-one power semiconductor module | Electricity | 2 | Active |
| US11387270B2 | Image sensor package including reflector | Electricity | 0 | Active |
| US9123688B2 | Semiconductor module package | Electricity | 0 | Active |
| US7670878B2 | Method for manufacturing semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.