Processing apparatus and device manufacturing method
US9123760B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2013 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Oct 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus of the present invention processes for a wafer. The processing apparatus includes an XY stage which includes a wafer chuck which holds the wafer and an elevating device which rises relative to the wafer chuck to hold the wafer, and a wafer conveying robot hand which conveys the wafer from the XY stage at a wafer transfer position. The XY stage moves to change a direction at an angle between degree and degree via the wafer transfer position in a state where the elevating device rises relative to the wafer chuck. The wafer conveying robot hand has a shape which does not interfere with the XY stage which moves to change the direction at the angle when the wafer conveying hand is positioned at the wafer transfer position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.