Patent · US Active

Method of manufacturing a component comprising cutting a carrier

US9123764B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Behrens · Madison, US
Joachim Mahler · Regensburg, DE
Ivan Nikitin · Regensburg, DE

Key dates

Filing date	Aug 24, 2012
Grant date	Sep 1, 2015
Priority date	—
Expiry date	Jan 19, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/0448
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.