Development of high-viscosity bonding layer through in-situ polymer chain extension
US9127126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Nov 6, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.