Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths
US9128121B2 · kind B2 · utility
1Cited by
9References
18Claims
0Family size
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Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.