Interposer test structures and methods
US9128123B2 · kind B2 · utility
29Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2011 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Nov 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.