Finger sensing structure for capacitive fingerprint recognition IC
US9129143B2 · kind B2 · utility
3Cited by
2References
8Claims
0Family size
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Key dates
| Filing date | Jun 13, 2014 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jun 13, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1306
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A finger sensing structure for a capacitive fingerprint recognition IC is provided here. The structure comprises a finger sensing metal layer with fish bone shape. When fingers approach or touch the surface of the capacitive fingerprint recognition IC, capacitive sense is induced between the fingers and the metal patterned layer to wake up the IC. Before the fingers approach or touch the IC, the IC is hibernated; once the fingers are detected, the IC is woken up. The metal patterned layer can reduce energy consumption of the IC especially for portable fingerprint recognition IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.