Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
US9129898B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
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Key dates
| Filing date | Jul 2, 2013 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83192
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.