Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package
US9129908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2011 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jan 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10507
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.