Apparatus for mounting semiconductor device
US9130011B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2011 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jun 26, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.