MEMS device assembly and method of packaging same
US9131325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jul 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An assembly (220) includes a MEMS die (222) and an integrated circuit (IC) die (224) attached to a substrate (226). The MEMS die (222) includes a MEMS device (237) formed on a substrate (242). A packaging process (264) entails forming the MEMS device (237) on the substrate (242) and removing a material portion of the substrate (237) surrounding the device (237) to form a cantilevered substrate platform (246) suspended above the substrate (226) at which the MEMS device (237) resides. The MEMS die (222) is electrically interconnected with the IC die (224). A plug element (314) can be positioned overlying the platform (246). Molding compound (32) is applied to encapsulate the die (222), the IC die (224), and substrate (226). Following encapsulation, the plug element (314) can be removed, and a cap (236) can be coupled to the substrate (242) overlying an active region (244) of the MEMS device (237).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.