Radio frequency package on package circuit
US9131634B2 · kind B2 · utility
3Cited by
3References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5317
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.