Electroplating composition for coating a substrate surface with a metal
US9133560B2 · kind B2 · utility
0Cited by
11References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 20, 2006 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jun 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer with a seed layer, This composition comprises a source of copper ions, in a concentration of between 0.4 and 40mM; at least one copper complexing agent chosen from the group of primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the composition being less than 7, preferably between 3.5 and 6.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.