Pixel via and methods of forming the same
US9134527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2011 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | May 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners and along at least one edge region of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, and depositing a mechanical layer over the optical stack. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via disposed in the dielectric layer and electrically connecting the stationary electrode to the black mask, the via disposed in a position along an edge of the first pixel, spaced offset from the edge of the first pixel in a direction towards the center of the first pixel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.