Apparatus and method for treating substrate
US9136147B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Dec 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.