Expanded semiconductor chip and semiconductor device
US9136219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2014 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jan 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first semiconductor chip having a surface provided with first electrodes; and an expanded semiconductor chip including a second semiconductor chip and an expanded portion extending outward from at least one side surface of the second semiconductor chip. The expanded semiconductor chip has a surface provided with second electrodes. The surface of the first semiconductor chip provided with the first electrodes faces the surface of the expanded semiconductor chip provided with the second electrodes so that the first electrodes are connected to the second electrodes. Each one of the second electrodes that is connected to an associated one of the first electrodes is located only on the expanded portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.