Stacked LED for optical sensor devices
US9136258B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2014 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Apr 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F55/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optical sensor device, system, and method are described that include a substrate, an electronic device disposed on the substrate, a molding layer, a lens, and a light-emitting diode (LED) package disposed on the substrate and at least partially over the sensor and molding layer. The LED package can include an LED substrate, an LED, a lens disposed on the LED, and electrical interconnections for coupling the LED to the substrate. In implementations, a process for fabricating the optical sensor device includes backgrinding a sensor die to a slim profile; attaching the sensor die onto a substrate; placing a molding layer on the sensor die; forming a lens on the molding layer; and placing an assembled light-emitting diode package on the substrate and at least partially over the sensor die and molding layer, where the assembled light-emitting diode package includes a 3D substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.