Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same
US9138857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2011 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Oct 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.