Hwatsing Technology Co., Ltd.
4Patents
4Active
4Granted
50Portfolio score
Filing activity: Jun 8, 2011 → Jun 28, 2024
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9138857B2 | Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same | Performing Operations; Transporting | 5 | Active |
| US10857646B2 | Apparatus for chemical-mechanical polishing | Performing Operations; Transporting | 0 | Active |
| US12151335B1 | Monitoring method for chemical mechanical polishing and chemical mechanical polishing device | Performing Operations; Transporting | 0 | Active |
| US9255780B2 | Method for measuring thickness of film on wafer edge | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.